Description
Is a tacky pressure sensitive adhesive loaded with thermally conductive ceramic fillers that do not require a heat cure cycle to form an excellent bond to many substrates.

Designed to provide a preferential heat-transfer path between heat-generating components and heat sinks or other cooling devices (e.g., fans, heat spreaders or heat pipes). It is modestly soft and able to wet to many surfaces, allowing it to conform well to non-flat substrates, provide high adhesion, and act as a good thermal interface. Offers excellent adhesive performance with good wetting and flow onto many substrate surfaces. Offers both good thermal conductivity and good electrical insulation properties. Only pressure is needed to form an excellent bond and thermal interface.