Description
It features a unique combination of attributes that include high thermal conductivity, good gap-filling capability, good dielectric properties, low contact stresses and long-term reliability.

Consists of a highly conformable, slightly tacky silicone-elastomer sheet filled with thermally conductive ceramic particles and supported by protective release liners on both sides. It is designed to provide a preferential heat-transfer path between heat-generating IC packages and heat sinks or other cooling devices (e.g., fans or heat pipes). Their specialized silicone chemistry renders them extremely soft and compliant, allowing them to conform intimately to non-flat substrates, even at moderate pressures.